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Public company intelligence preview

MICRON TECHNOLOGY INC

417 insider trades surfaced from the last year. This page shows only aggregate signals, not the underlying transactions, people, filings, filters, or AI workspace.

Snapshot

A narrow read on a much deeper workspace.

The preview gives search visitors enough signal to understand coverage. It does not expose transaction records, person-level profiles, filters, comparisons, or analyst workflows.

Insider trades, last 12 months
417
54 filed in the last 30 days
Acquisition / disposition count
97/320
Buy / Sell
Unique insiders active in the last year
18
Current insider positions tracked
36
32 active, 4 exited

Insider compensation

Public aggregate: $12.3M average total compensation across covered insiders.

Governance movement

Public aggregate: 1 governance events in the last year.

Institutional ownership

Public aggregate: 2,629 holders from the latest quarter.

Restricted sales and governance

Public counts, not the investigation layer.

The full product opens the underlying filings, insider context, historical holdings, comparison tools, and AI analysis.

Restricted-sale filings, 1Y
43
Restricted-sale insiders, 1Y
13
Planned sale shares, 1Y
964.2K
Planned sale value, 1Y
$221.6M
Insiders covered
9
Latest year: 2025
Personnel changes, 1Y
1
Board appointments, 1Y
0
Board departures, 1Y
1

Market context

Basic quote context for the preview.

Price
$698.74
Market cap
$768.6B
Volume
61,795,087
EPS
$12.07
Revenue
$23.9B
Employees
53.0K

Company note

Context before the data.

Company Overview

Micron Technology Inc. is a leading semiconductor memory and storage company in the Technology sector, focused on DRAM, NAND, and NOR products, plus SSDs and managed storage solutions. Its business is heavily tied to AI, cloud/data center, mobile, automotive, and industrial demand, with a major revenue mix increasingly skewed toward higher-margin data center and HBM products. Recent filings show a very strong operating environment, driven by sharp pricing gains, modest shipment growth, and tight industry supply, which pushed margins and earnings materially higher. The company is also highly capital intensive, with global fabs, advanced packaging, and major capacity expansion projects in the U.S. and abroad.

Executive Compensation Practices

For a Semiconductors company like Micron, executive compensation is likely tied closely to revenue growth, gross margin, operating income, free cash flow, and execution on technology roadmaps and fab expansion. Micron’s recent results suggest performance-based pay could be especially sensitive to ASP improvements, AI/data center mix, manufacturing cost reductions, and capacity ramp milestones, rather than just top-line growth alone. Given the company’s heavy capex profile and CHIPS Act-related funding, compensation frameworks may also include strategic metrics such as project completion, yield improvement, advanced-node transition progress, and capital efficiency. In years like fiscal 2025 and fiscal 2026, when profitability and cash flow improved sharply, bonus and equity awards could be meaningfully impacted by these operational outcomes.

Insider Trading Considerations

Insider trading patterns in Micron may be influenced by the cyclical nature of memory pricing, inventory conditions, and quarterly visibility into AI-driven demand, all of which can cause large swings in reported results. Because the company is making major bets on new fabs, advanced packaging, and government-incentivized expansion, executives may be particularly sensitive to material events such as CHIPS funding timing, capex execution, and export-control developments affecting China exposure. The company’s strong dependence on a limited number of large customers and its rapid margin changes could make trading windows especially important around earnings and supply-allocation updates. As a Technology and Semiconductors issuer, Micron insiders are also likely subject to heightened scrutiny around material nonpublic information tied to pricing trends, customer demand, and product-node transitions such as HBM and next-generation DRAM/NAND.

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